@sun @c00lvibrations @cassidyclown @mrsaturday the problem is that would reflow the flip-chip bumps too because they melt at a similar a temperature since they are also solder technically. For the PS3 at least, the theory of the guy who did the analysis was that reballing only works temporarily up to maybe a year but as low as a few days (based on information from people who had it done) because the bumps are the real problem and are only temporarily fixed because of re-flowing during the reball. Since the solder in the bumps is not replaced (and can't be because its microscopic far smaller than solder balls) it always fails again.