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bro was eating the discs
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@mrsaturday @icst @c00lvibrations @cassidyclown they used lead-free solder on an in-house custom board they designed without outside professional help, and when the board heated it flexed and the solder cracked and expanded apart
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@mrsaturday @c00lvibrations @cassidyclown I remember reading somewhere that microsoft intentionally designed the original 360 model's disc drive, without certain common protections to prevent that, in order to save a measly 5-10 cents per unit.
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@icst @c00lvibrations @cassidyclown It's also why they used bargain basement thermal paste, which is what caused all of the RRoD errors in earlier models
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@cassidyclown @c00lvibrations The 360 had really shitty disc readers, I'm not surprised. I think only the Dreamcast had it worse
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@c00lvibrations he makes it sound like a vinyl getting worn out
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@icst @c00lvibrations @cassidyclown @mrsaturday the fix is you get the cpu solder points reballed
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@sun @c00lvibrations @cassidyclown @mrsaturday was it the solder on an in house board? because I thought it was actually the flip-chip bumps that were defective (because of lead free solder also).
I was looking this stuff up a few months ago because I was curious about ps3 fats and if any actually exist that wont eventually have GPU failures if you use them enough. Basically they are all defective due to bump joints and the guy who I watched did some autistic deep drive into it and pretty much proved it. And I think he concluded the problem with the 360 as well as the problems with Apple Laptop GPU failures that happened during the late 2000s were also all the same kind of bump failures due to lead free solder.
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@icst @c00lvibrations @cassidyclown @mrsaturday > the theory of the guy who did the analysis was that reballing only works temporarily up to maybe a year
That is correct, there is no permanent fix.
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@sun @c00lvibrations @cassidyclown @mrsaturday the problem is that would reflow the flip-chip bumps too because they melt at a similar a temperature since they are also solder technically. For the PS3 at least, the theory of the guy who did the analysis was that reballing only works temporarily up to maybe a year but as low as a few days (based on information from people who had it done) because the bumps are the real problem and are only temporarily fixed because of re-flowing during the reball. Since the solder in the bumps is not replaced (and can't be because its microscopic far smaller than solder balls) it always fails again.