FPGA in reballing fixture in oven
https://files.ioc.exchange/media_attachments/files/111/706/453/693/367/408/original/e751f3c0f365813d.jpg
This time I added witness solder on Kapton tape pads on both the FPGA package and the fixture. They melted quite a bit later than the adjacent board did.
Gave it 45 sec after *they* melted and hopefully it's good. I don't want to put more thermal cycles on this chip than I have to. I've already violated the absolute max ratings enough :)
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