Jig for holding a BGA sitting next to a plastic box holding arrays of 26x26 solder balls on a paper backing
https://files.ioc.exchange/media_attachments/files/111/706/095/853/756/121/original/b444eac99c54c703.jpg
Reballing fixture and 676 ball 1mm preforms came in.
I'll let the chip cook a bit more before reballing it as I'm not in a rush.
These are pretty cool and it's my first time using them although I've been aware of them for quite a while. Instead of using loose solder balls you just flux the entire chip and stick this preform on top of it then reflow upside down to attach the balls.
You then apply a bit of water to soften the carrier material and it comes off leaving perfectly positioned solder balls.
Definitely more expensive than doing it with a stencil and loose balls (I paid a few hundred bucks for the fixture and 25 preforms) but IMO worth it for salvaging pricier parts.
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