i wonder if TI's parts "for cost-sensitive systems" are rebadged higher performance parts. i mean, it's not like they're saving cost on the die
Conversation
Notices
-
Embed this notice
teddy (tedyapo@fosstodon.org)'s status on Saturday, 09-Aug-2025 00:06:08 JST
teddy
-
Embed this notice
botvolution (botvolution@mastodon.sdf.org)'s status on Saturday, 09-Aug-2025 00:06:07 JST
botvolution
I read somewhere that they're simply the same devices as the higher spec but which on testing have only passed to a lower spec; which fits well with the gapfiller idea too of course.
-
Embed this notice
Marcus Müller (funkylab@mastodon.social)'s status on Saturday, 09-Aug-2025 00:06:08 JST
Marcus Müller
@tedyapo For other "classic" semiconductor vendors, I've been told these are probably "gapfiller" runs done when one of the older fabs/lines isn't busy producing high-margin long-term (milgrad?) parts, and the "run the dirt out parts" you get when reopening a line after maintenance, where you don't produce large-area die due to low yield, and for the small parts, the characterization costs are too high for it to make commercial sense to qualify them to the same degree as the higher-spec parts.
-
Embed this notice