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1. Embed this notice
   Andrew Zonenberg (azonenberg@ioc.exchange)'s status on Wednesday, 25-Dec-2024 05:34:08 JST Andrew Zonenberg

   Sending the LATENTRED line card designs off to fab for a quote!

   Final gerber review to look for anything else funky. Saw two minor silkscreen issues and fixed them, everything else looked good.

   • Embed this notice
     Ignas Kiela (ignaloidas@not.acu.lt)'s status on Wednesday, 25-Dec-2024 05:34:06 JST Ignas Kiela

     in reply to

     • Fritz Adalis

     @azonenberg@ioc.exchange @FritzAdalis@infosec.exchange already done by raspberry pi

     Haelwenn /элвэн/ :triskell: likes this.
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     Fritz Adalis (fritzadalis@infosec.exchange)'s status on Wednesday, 25-Dec-2024 05:34:07 JST Fritz Adalis

     in reply to

     @azonenberg
     Is that the Godot logo?

     Haelwenn /элвэн/ :triskell: likes this.
   • Embed this notice
     Andrew Zonenberg (azonenberg@ioc.exchange)'s status on Wednesday, 25-Dec-2024 05:34:07 JST Andrew Zonenberg

     in reply to

     • Fritz Adalis

     @FritzAdalis Lol. Does kinda look like it, doesn't it.

     Quick, somebody start designing chips where the BGA breakout spells your company logo or something.

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     Andrew Zonenberg (azonenberg@ioc.exchange)'s status on Wednesday, 25-Dec-2024 05:34:08 JST Andrew Zonenberg

     in reply to

     Layer 2 ground plane, including various cutouts under connector pads and BGA lands for impedance matching