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Paul Sutton (zleap@qoto.org)'s status on Sunday, 08-Dec-2024 01:39:45 JST Paul Sutton
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Looks good

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  IT News (itnewsbot@schleuss.online)'s status on Sunday, 08-Dec-2024 01:39:47 JST IT News
  
  Broadcom unveils gigantic 3.5D XDSiP platform for AI XPUs — 6000mm² of stacked silicon with 12 HBM modules - Broadcom's 3.5D XDSiP platform for high-performance process... - https://www.tomshardware.com/tech-industry/artificial-intelligence/broadcom-unveils-gigantic-3-5d-xdsip-platform-for-ai-xpus-6000mm2-of-stacked-silicon-with-12-hbm-modules #artificialintelligence #techindustry
  In conversation about 2 months ago permalink
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    Broadcom unveils gigantic 3.5D XDSiP platform for AI XPUs — 6000mm² of stacked silicon with 12 HBM modules
    
    Monstrous 3.5D processors for AI and HPC are incoming.

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