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   Andrew Zonenberg (azonenberg@ioc.exchange)'s status on Tuesday, 15-Oct-2024 15:30:10 JST Andrew Zonenberg

   in reply to

   @ftg @dlharmon @g4dbn Yeah, I get the concept. It's more a question of how bad things would be without it on really-small cable (where you might not even need the bend, just use more solder than usual).

   The center conductor is 290 μm, dielectric 920, shield 1190.

   So the difference in radius between the dielectric and center conductor is only 315 μm.

   I guess the other question is how cheaply I could get my PCB fab to do controlled-depth milling...