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Flip chip BGA package with bare die visible

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https://files.ioc.exchange/media_attachments/files/111/999/512/429/529/270/original/960c03483e021baa.jpg

Notices where this attachment appears

  1. Embed this notice
    Andrew Zonenberg (azonenberg@ioc.exchange)'s status on Wednesday, 27-Mar-2024 03:35:54 JST Andrew Zonenberg Andrew Zonenberg
    in reply to

    The thermal pad I'm using is only 15mm square, not enough to cover the whole package, but it comfortably covers the die. Not like the bypass caps or substrate need cooling anyway.

    In conversation about 7 months ago from ioc.exchange permalink
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